Cooling Infrastructure for the AI Era
Expansion joints, flexible connectors, and pump isolation components engineered for direct-to-chip and immersion cooling systems
Why Cooling Infrastructure Fails in AI Data Centers
Thermal Cycling Fatigue
AI workloads drive hundreds of thermal cycles per year. Generic HVAC-grade expansion joints fatigue and fail under these conditions.
Chemical Incompatibility
Glycol coolants and dielectric fluids degrade standard elastomers. EPDM, FKM, and PTFE materials must be matched to the specific fluid chemistry.
EFP-Engineered Solutions
Purpose-built flexible connectors rated for data center operating pressures, temperatures, and chemical environments.
Cooling Infrastructure Components
Rubber Expansion Joints
EPDM and FKM compounds for glycol and dielectric service. 301 and 302 series.
Metal Expansion Joints
316 SS bellows for high-reliability, high-cycle applications.
PTFE Expansion Joints
Chemical-resistant joints for dielectric fluid loops and immersion cooling.
Pump Connectors
Vibration isolation at CDU pumps, chiller pumps, and secondary circulation.
Flexible Metal Hose
Braided stainless steel for equipment connections and CDU-to-rack runs.
Pipe Guides and Anchors
Precision placement to direct thermal expansion into expansion joints.
Material Selection by Cooling Architecture
| Parameter | Direct-to-Chip | Immersion (1-Phase) | Immersion (2-Phase) |
|---|---|---|---|
| Coolant | Water-Glycol | Synthetic Hydrocarbon | Fluorocarbon |
| Pressure | 30-60 PSI | Under 20 PSI | Under 15 PSI |
| Temp Range | 15-45C+ | 25-60C | 30-50C |
| Elastomer | EPDM | FKM/Viton | PTFE Required |
| Joint Type | Rubber or Metal | Metal or PTFE-lined | PTFE-lined |
| Leak Tolerance | Low | Zero | Zero |
Spec Your AI Data Center Cooling Infrastructure
Our engineering team provides specification support, custom sizing, and rapid delivery for compressed project timelines.
- Phone: 1-800-CALL-EFP
- Email: sales@efp-web.com
- Mon-Fri 7AM-5PM CST